| Semiconductor examples |
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| Date:
January 2008 |
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| Client:
Advantest |
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| Magazine:
Evaluation Engineering |
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| Article
title: EVM feature article |
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| http://www.evaluationengineering.com/features/2008_january/0108_ic_ate.aspx |
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| Date:
December 2007 |
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| Client:
Pall Corporation |
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| Magazine:
Controlled Environments |
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| Article
title: Environmental monitoring & Rapid Micro Methods feature article |
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| http://www.cemag.us/articles.asp?pid=718 |
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| Date:
September 2007 |
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| Client:
Flomerics, Inc. |
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| Magazine:
Controlled Environments |
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| Article
title: Eichleay Engineers case history |
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| http://www.cemag.us/articles.asp?pid=697 |
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| Date:
July 2007 |
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| Client:
ESI Group |
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| Magazine:
Small Times |
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| Article
title: Sandia case history |
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| http://www.smalltimes.com/display_article/297679/109/ARTCL/none/none/Simulation-software-speeds-microfluidics-development/ |
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| Date:
May 2007 |
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| Client:
Expandable Software |
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| Magazine:
U.S. Tech |
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| Article
title: Photon Dynamics case rewrite |
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| http://www.us-tech.com/default.aspx?RelID=608439&issearch=expandable#item608939 |
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| Date:
March 2007 |
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| Client:
Flomerics, Inc. |
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| Magazine:
Advanced Packaging |
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| Article
title: Compact Thermal Modeling of Semiconductor Packages: An Industry Update
feature article |
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| http://ap.pennnet.com/display_article/286250/36/ARTCL/none/none/Compact-Thermal-Modeling:-Impacting-the-industry/ |
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| Date:
December 2006 |
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| Client:
Teradyne Assembly Test Division |
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| Magazine:
Printed Circuit Design & Manufacture |
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| Article
title: Short-Wire Fixtures feature article proposal |
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| http://pcdandm.com/cms/content/view/3113/95/ |
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| Date:
November 2006 |
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| Client:
Flomerics, Inc. |
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| Magazine: Printed
Circuit Design & Manufacture |
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| Article
title: Concurrent Engineering Helps Meet Thermal Challenges of High Speed
Design |
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| http://pcdandm.com/cms/content/view/3050/95/ |
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| Date:
October 2006 |
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| Client:
Pall Corporation |
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| Magazine:
Cleanrooms |
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| Article
title: Cleanroom feature article |
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| http://cr.pennnet.com/display_article/275472/15/ARTCL/none/none/PAT,_tougher_standards_push_improved_microbial_air_monitoring/ |
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| Date:
September 2006 |
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| Client:
Flomerics, Inc. |
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| Magazine:
Advanced Packaging |
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| Article
title: Multichip stacked die characterization feature article |
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| http://ap.pennnet.com/Articles/Article_Display.cfm?ARTICLE_ID=270991&p=36 |
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| Date:
September 2006 |
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| Client:
Teradyne Assembly Test Division |
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| Magazine:
Evaluation Engineering |
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| Article
title: Best Practices Approaches to Wireless Fixturing feature |
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| http://www.evaluationengineering.com/archive/articles/0906/0906the_selection.asp |
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| Date:
May 2006 |
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| Client:
Flomerics, Inc. |
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| Magazine:
Cleanrooms |
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| Article
title: Simulating cleanroom design feature article |
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| http://cr.pennnet.com/articles/article_display.cfm?Section=ARTCL&C=Feat&ARTICLE_ID=256854&KEYWORDS=Flomerics%20&p=15 |
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| Date:
May 2006 |
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| Client:
Flomerics, Inc. |
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| Magazine:
Controlled Environments |
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| Article title:
Flovent entry for Experts Choice Awards |
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| http://www.cemag.us/ceec/pr4.asp |
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| Date:
March 2006 |
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| Client:
Made2Manage Systems, Inc. |
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| Magazine:
U.S. Tech |
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| Article
title: Abbatron case history |
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| http://www.us-tech.com/np/ustech/files/guestD2030799846A.html |
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| Date:
March 2006 |
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| Client:
Flomerics, Inc. |
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| Magazine:
Advanced Packaging |
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| Article
title: NVIDIA rewrite |
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| http://ap.pennnet.com/Articles/Article_Display.cfm?Section=ARTCL&ARTICLE_ID=249865&VERSION_NUM=2&p=36 |
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| Date:
March 2006 |
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| Client:
Advantest |
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| Magazine:
Evaluation Engineering |
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| Article title: Memory Test Trends |
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| http://www.evaluationengineering.com/archive/articles/0306/0306ic_ate.asp |
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| Date:
January 2006 |
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| Client:
ANSYS |
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| Magazine:
Solid State Technology |
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| Article
title: POW/eV PRODUCTS case history |
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| http://sst.pennnet.com/Articles/Article_Display.cfm?ARTICLE_ID=246521&p=5&cat=FEATA |
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| Date:
October 2005 |
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| Client:
Teradyne Assembly Test Division |
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| Magazine:
Evaluation Engineering |
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| Article title: PCB
Inspection Technology Trends |
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| http://evaluationengineering.com/archive/articles/1005/1005pcb_inspection.asp |
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| Date:
July 2005 |
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| Client:
Made2Manage Systems, Inc. |
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| Magazine:
U.S. Tech |
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| Article
title: Zentech Manufacturing, Inc. rewrite |
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| http://www.us-tech.com/np/ustech/files/guestD632077021A.html |
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| Date:
September 2003 |
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| Client:
Flomerics, Inc. |
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| Magazine:
Advanced Packaging |
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| Article
title: AMD case history |
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| http://ap.pennnet.com/articles/article_display.cfm?Section=ARCHI&C=Feat&ARTICLE_ID=185774&KEYWORDS=Flomerics&p=36 |
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| Date:
September 2003 |
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| Client:
ANSYS |
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| Magazine:
Solid State Technology |
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| Article
title: MAT/Semiconductor processing feature article |
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| http://sst.pennnet.com/articles/article_display.cfm?Section=ARCHI&C=Dept&ARTICLE_ID=185341&KEYWORDS=fluent%20fluid%20flow%20distribution&p=5 |
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| Date:
April 2000 |
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| Client:
Bergquist Co. |
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| Magazine:
Advanced Packaging |
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| Article
title: Thermal Interface for BGAs feature article |
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| http://ap.pennnet.com/articles/article_display.cfm?Section=ARCHI&C=Feat&ARTICLE_ID=75689&KEYWORDS=Thermal%20Interface%20for%20BGAs%20&p=36 |
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